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Publiée 22 août 2026

Electrical Engineer (Ground Control System)

Harmattan AI
Paris, Île-de-France 75000, France CDI

About Us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.

Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

Overview

Harmattan AI is developing new hardware products within the GCS module, including ruggedised drone controllers and long-range RF systems designed for demanding field environments. These products require dedicated electronics design with complex architecture in a constrained environment - PCBs integrating RF modules, microcontrollers, power management, and communication interfaces - optimised for cost at volume. The GCS team is seeking a dedicated hardware engineer to own electronics design end-to-end and accelerate the path to production milestones.

Ideal candidate

A senior hardware engineer who has designed and shipped complex PCBs, ideally mixing digital and power, into production. They are rigorous on schematics, layout, and bring-up, and have a strong instinct for cost and manufacturability. They are comfortable working autonomously in a small team and can bridge hardware and firmware.

Skills required
  • PCB schematic and layout design (Altium Designer preferred)
  • RF PCB design: controlled impedance, antenna matching, EMC management
  • Mixed-signal design: power management, MCU interfaces, communication buses (SPI, I2C, UART, USB, CAN)
  • Hardware bring-up and debug: bench equipment proficiency
  • DFM/DFA for PCB manufacturing and assembly
  • Component selection and BOM management

Responsibilities:
  • Schematic Design - Design complete schematics for mixed-signal and RF boards, from power to digital and RF sections.
  • PCB Layout & Routing - Perform or lead board placement and routing with attention to signal integrity, EMC, and RF constraints (6-8 layer layout, controlled impedance, ground planes, and RF traces).
  • Component Selection & BOM Optimisation - Select components with cost, availability, and reliability in mind; drive BOM cost reduction for mass production volumes.
  • Hardware Bring-up & Debug - Lead board bring-up and debug issues with oscilloscopes, spectrum analysers, and other bench equipment; write bring-up scripts when needed.
  • EMC & RF Compliance - Address EMC challenges; ensure signal integrity across the board and correct RF performance (antenna impedance matching and power levels).
  • Collaboration with Embedded SW - Work closely with the embedded software engineer to define hardware/software interfaces; support firmware bring-up.
  • Collaboration with Mechanical - Ensure seamless PCB integration into mechanical enclosures (connectors, mounting, thermal, shielding).
  • Supplier & Manufacturing Ramp-up - Qualify PCB manufacturers and assembly houses; support DFM/DFA review for production; manage NPI transitions.
  • Documentation - Maintain schematics, layout files, test procedures, and hardware specifications.


We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

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